Product Description

The CMI 760 series is designed to meet the needs of copper thickness measurement and quality control in the printed circuit board industry.CMI760 can be used to measure the thickness of surface copper and copper inside perforations. This highly scalable desktop thickness gauge system can use both micro resistance and eddy current methods to achieve accurate and precise measurement of surface copper and copper thickness inside perforations. The CMI 760 desktop measurement system has high versatility and scalability, and its compatibility with multiple probes enables it to meet various application requirements, including measuring the thickness of surface copper, perforated copper, and microporous copper, as well as testing the quality of copper in holes.At the same time, CMI760 has advanced statistical functions for organizing and analyzing test data.

CMI760Highly flexible copper thickness gauges, circuit board hole copper&surface copper thickness gauges, and desktop thickness gauges use micro resistance and eddy current methods to measure surface copper and copper plating thickness inside holes. It has multifunctionality, high scalability, and advanced statistical functions, which are used for data organization and analysis.

SRP-4 copper probe testing technical parameters	Technical parameters for ETP hole copper probe testing
Copper thickness measurement range: Chemical copper: 0.25 μ m-12.7 μ m (10 μ in-500 μ in) Electroplated copper: 2.5 μ m-254 μ m (0.1mils-10mils) Linear copper wire width range: 203 μ m-7620 μ m (8mil -300mil) Accuracy: ± 1% (± 1 μ m) reference standard film Accuracy: Chemical copper: standard deviation of 0.2%, electroplated copper: standard deviation of 0.3% Resolution: 0.1 μ m ≥ 10 μ m, 0.01 μ m ＜ 10 μ m, 0.001 μ m ＜ 1 μ m, 0.01mil ≥ 1mil, 0.001mil ＜ 1mil	Measurable hole * small diameter: Φ 0.899mm (35mils) Aperture range: 0.899mm -3.0mm Thickness range: 2 μ m-102 μ m (0.08-4.0 mils) Accuracy: ± 0.01mil (0.25 μ m) ＜ 1mil (25 μ m) Accuracy: 1% achieved at 1.2milS (under laboratory conditions) Resolution: 0.01mil (0.25 μ m)
Technical parameters for TRP-M (microporous) probe testing
*Small testable hole diameter range: 10-40 mil (254-101)6 μm) Copper thickness testing range inside the hole: 0.5-2.5mils (12.7-63.5 μ m) *Tested board thickness: 175mil (4445 μ m) *Small testable board thickness: The minimum value of the board thickness must be 3mils (76.2 μ m) higher than the corresponding small hole diameter value of the tested circuit board Accuracy (comparative metallographic testing method): ± 0.01 mil (0.25 μ m)<1="" mil="" (25=""> ±10%≥1mil(25 μm) Accuracy: It is not recommended to conduct multiple tests on the same hole Resolution: 0.01 mil (0.1 μ m)

TRP probe：Equipped with TRP probe, CMI760 can accurately test the quality of perforation, including cracks, voids, and unevenness of copper plating inside the hole. The 36 point measurement system of TRP is from Oxford Instruments, which quantifies the quality of perforated copper plating, and only Oxford Instruments has this product. The conical probe ensures the repeatability of three contact points to ensure measurement accuracy, repeatability, and reproducibility.

About Us

The products and system solutions of Duzhi Instrument (Shanghai) Co., Ltd. are widely used in research laboratories and production lines, quality control and education industries such as large and medium-sized state-owned enterprises, automobile manufacturing, precision machinery, mold processing, electronic power, casting metallurgy, aerospace, engineering construction, colleges and universities. They are used to evaluate the geometric characteristics and physical and chemical properties of materials, components and structures, and promote the excellence of advanced manufacturing technology.